lead frames

complex, smaller and thinner assembly solutions

Semiconductors are attached to these thin layers of metal frame as part of the package assembly process. Quality is essential: any tiny defect seriously affects the performance and reliability of the resulting insulated circuit device.

 

lead frames

As semiconductor processes and design technologies become increasingly sophisticated, there is an ongoing demand for more complex, smaller and thinner assembly solutions.

Traditionally, lead frames have been machine-produced (e.g. stamped). For precision-engineered components, we advocate the chemical etching process in order to achieve a high level of accuracy, ultra fine tolerances and a reduction in production lead time (up to one-tenth of the time compared to stamping).

key features

complex features
smooth, burr and stress-free
ultra fine tolerances
in-house plating and finishing facility
high lead density
short lead times
co-develop your lead frames with Tecan
contact an engineer