• Controlled, localised printing for single components
• Accurate repeatable results
• Single shot solution using full width squeegee
• Interface to any rework station
• Effective solder paste containment

Tecan rework stencils ensure accurate and repeatable printed results for single component footprints, such as QFPs, PLCCs, BGAs, µBGAs and SM Connectors, when replaced during PCB rework operations.

Rework stencils mimic the footprint and aperture sizes corresponding to both the device requirements and the original stencil used in production. In combination with a rework station, alignment is simple, resulting in a controlled 'right first time' process.

Rework stencils are rigid to ensure positive gasketing with the PCB surface. Compact designs include minimal stencil projection beyond the image to be printed thereby enabling use in all situations, especially high-density component areas. Accurately folded edges and run-on / run-off areas ensure effective paste roll and containment without causing interference to other components on the populated PCB.

In operation the stencil is accurately aligned over the "cleaned" copper pads and paste is printed in a single pass using the full-width mini squeegee blade provided.

Stencils are supplied as complete assemblies with all necessary interfaces to suit your existing rework station or system.

Stencil technology	Dimensional tolerance	Paste release	Ease of forming
Etched	± 7µ	4
Laserformed	± 5µ	4
Electroformed	± 5µ	5

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