• Bespoke for your rework requirement
• Accurate application of correct volume of flux
• Avoidance of contamination
• Easy-to-use

Dip transfer plates enable the accurate application of precise flux volumes to the lower quartile of the solder balls of Ball Grid Array (BGA) components, thereby eliminating excessive flux contamination on the underside of the reflowed component.

Tecan's precision-etched dip transfer plates are bespoke for the device to be reworked and come supplied complete with the required squeegee blade.

Dip transfer plates are typically supplied with recesses equivalent to 25% of the ball diameter. Tecan can also supply depth variations to suit individual requirements.

Contact us to discuss your requirements or talk to one of our technical advisers who are online now to answer any questions you may have - simply click on the live help icon.