- Bespoke for your rework requirement
- For depositing paste on to the balls of the BGA device
Tecan direct component printing stencils are used for depositing paste onto the balls of the BGA device itself, where the printed device will be picked and placed onto the printed circuit board (PCB) and subsequently reflowed.
Direct component printing stencils are bespoke and are supplied with a suitable frame for the rework machine and squeegee being used.
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