• Bespoke for your rework requirement
• 2 types - print paste or ball place
• Printing paste for single operation
• Ball place for more regulated spheres and consistency

Bespoke BGA re-balling stencils from Tecan are available in two formats.

When printing paste it is necessary to use thicker stencils to ensure the exact volume of solder paste is transferred onto the BGA. Subsequent reflow is used to create new solder sphere terminations.

For ball placement requirements the stencil is precisely registered to ensure new solder spheres are placed on to pre-printed flux deposits.

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