- For SM and leaded components
- Full consultation and implementation programme
- Aperture design/modification service
- Productivity and quality improvements
- Multi-level stencil options
- Available in meshed and all re-mountable formats
PIHR is becoming more popular as a cost-effective assembly method for PCBs containing both Surface Mount and leaded connectors and components. Success is largely dependent on stencil design and optimisation to satisfy the volume of solder paste required for all fillet volumes.
Although it is widely known that printing paste onto both SM pads and leaded pads/holes is possible on most printing machines, many users are uncertain about the design of the correct aperture size, shape or thickness to optimise the process. Tecan's extensive knowledge and practical experience of successful PIHR implementation delivers proactive help and appropriate stencil solutions.
A complete package from stencil design, practical design reviews to workshops and training is available. Contact us now to discuss your requirements or talk to one of our technical advisers who are online now to answer any questions you may have - simply click on the live help icon.