Tecan provides a range of products to alleviate some of the problems created by the need to rework components.
Rework Stencils mimic the footprint and aperture sizes corresponding to both the device requirements and the original stencil used in production. In combination with a rework station, alignment is simple, resulting in a controlled 'right first time' process.
Rework stencils are rigid to ensure positive gasketing with the PCB surface. Compact designs include minimal stencil projection beyond the image to be printed, enabling use in high-density component areas. Accurately folded edges and run-on / run-off areas ensure effective paste roll and containment without causing interference to other components on the populated PCB.
Other rework solutions include dip transfer plates, BGA re-balling stencils, direct component printing stencils and reflow reflector shields.
Dip Transfer Plates enable the accurate application of precise flux volumes to the lower quartile of the solder balls of Ball Grid Array (BGA) components, thereby eliminating excessive flux contamination on the underside of the reflowed component.
BGA re-balling Stencils ensure the precise registration of new solder spheres onto pre-printed flux deposits.
Direct Component Printing Stencils are used for depositing paste onto the pads of the BGA device itself, where the printed device will be picked and placed onto the PCB and subsequently reflowed.
Reflow Reflector Shields provide critical protection for heat sensitive components on densely populated PCBs, where an adjacent device is to be reworked / reflowed.
|Rework stencils||Direct component printing stencils|
|Dip transfer plates||Reflow reflector shields|
|BGA re-balling stencils|