This assembly technique is used to provide an alternative to subsequent hand or wave soldering operations of leaded components - from crystal oscillators and headers to multi row connectors.
As with all SM technology, successful end-product quality relies on the accuracy and adequacy of the printed solder paste deposits. Optimised stencil design is an essential requirement to ensure the printing solution delivers successful PIHR results.
In its simplest form, the technique involves printing solder paste onto the PCB for both surface mount devices and leaded components. With PIHR it is essential that sufficient paste volume is available to ensure the required solder fillets are formed on the top and bottom sides of the PCB and in the component holes.
Following insertion of leaded components and placement of surface mount devices the assembly is reflowed. The main benefits of this are shorter product cycle-times, reductions in manufacturing costs and elimination of contamination by second operation flux deposits.
|Reflow reflector shields|