You are here: Home > Tecanology > Micro-Photo Electro Forming > Capabilities
Capabilities

The table below shows maximum achievable features and tolerances. All of these are dependent upon the nature of the project undertaken and may vary according to:
Material used
Overall surface area,
Packing density,
Variation of feature size across surface area
| SUBSTRATE SIZE (mm) | 300 x 300 | 150 x 150 | <150 x 150 |
| Aperture Sizes (min) | 3µm | 2µm | <1µm |
| Feature Sizes (min) | 3µm | 2µm | <1µm |
| Alignment Accuracy | 2µm | 1µm | <1µm |
| Aspect ratios/level (max) | 2:1 | 10:1 | 10:1 |
| Pitch (min) | 6µm | 4µm | <2µm |
| Levels | Multi-levels possible | ||
| Roughness | Dependant upon mandrel material. Optical finishes possible | ||
| Hardness (VPN) | ≈190-500 | ||
| Thickness uniformity/level | <1% of material thickness possible | ||
| Materials | Hard Nickel, Soft Nickel and epoxy | ||
| For plating and finishing options click here. | |||




