
Deposition mask techniques are used in a wide range of vacuum-chamber evaporation and sputtering processes to fabricate both simple and complex micro-engineered electronic components and products. They are increasingly being used to deposit inks onto substrates during the manufacture of flat panel displays.
Burr and stress-free
Ultra-sharp edge profiles
Rapid turnaround, low cost photo tooling
Precision finishing available for durability/improved cleaning
Single and multi-level sets available
Tecan's manufacturing technologies provide accuracy and durability advantages over conventional mask manufacturing techniques.
Burr-free aperture edges and controllable draft angles enable improved deposition performance.
Finished masks, produced in stainless steel and nickel with optional gold-plating, typically withstand post-deposition cleaning for up to 10 times longer than conventional masks.
Single masks, multi-mask sets and frame systems are all available dependent on the application. Multi-level masks can be produced with 'stepped' recesses, limiting the need for spacer sheets in multiple-sheet sets.
Contact us now to discuss your requirements or talk to one of our technical advisers who are online now to answer any questions you may have - simply click on the live help icon.
Specifications:
| Feature sizes | Down to +/-2 micron available* |
| Tolerances | Sub micron tolerances possible* |
| Alignment accuracy | Sub micron possible* |
| Pitch | 4 micron possible* |
| Materials | Stainless steel, hard or soft nickel |
| Frames | Available on request, contact us for details. |
| For plating and finishing options click here | |
| *dependent on application and manufacturing technology used | |




