A leadframe is a metal frame that semiconductors are attached to during the package assembly process. Tiny wires are used to connect the chip bond pads to the frame and then the positions on the frame where chips are located are encapsulated. After molding the encapsulated chips are mechanically broken loose from the frame rails and the parts of the frame protruding from the package become the package leads.

• Burr and stress-free leadframes
• High precision
• Rapid turnaround, low cost photo tooling
• Fast & inexpensive alternative to stamping

Tecan provides the semiconductor industry with highly accurate burr and stress-free leadframes. Ultra-fine pitch designs can also be cost-effectively produced with minimal impact on tooling.

Flexible tooling enables the production of prototypes in a matter of days, as opposed to weeks with stamping. Further design modification is equally straightforward - providing engineers with optimised leadframe designs, on time and to budget.

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