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STEP UP TO HYBRID LID SUPER SOURCE
Specialist electronic micro-component supplier, Tecan has developed design and manufacturing techniques which ensure semiconductor hybrid package manufacturers now have access to the most sophisticated, burr and stress-free stepped-lid technology available today.
A major factor in the company’s ability to provide such a ‘unique’ service is its ability to supply all necessary manufacturing techniques under one roof, ensuring the best possible quality control and consistency available. Electro-plating, for example is a function often contracted out by lid makers. Tecan points out that this a crucial area when it comes to repeatable accuracy.
Traditional manufacturing techniques, such as stamping or inaccurate etching, may produce lids with burrs, irregular edges or sheet fixing-tag remnants - all of which could potentially cause expensive rejects in automated lid-to-package sealing processes - where the whole package could be lost.
Highly-accurate and established photo-chemical machining techniques are used to manufacture the parts. The process also brings other value-added benefits at no extra cost - for example, part numbers, company contact details and other data can be readily etched onto the lid. Typical materials include nickel alloys such as Kovar, Dilver P and Olin 194, other materials are available on request. The company’s in-house electroplating processes encompass all expected finishes - from electroless nickel, to hard-acid gold and pure-soft gold.
Cost-effective solutions for all volume levels can be supplied – with rapid prototyping available on a five-day turnround. Tooling costs are low compared to other methods of manufacture and modifications can be quickly and cost-effectively accommodated. Tecan operates a strict ISO9002 manufacturing regime and can manufacture to UK and overseas military specifications.
The company accepts the following CAD formats: AutoCad DXF and DWG, GraphiCodeCAM PWK and CWK, DPF, Gerber, HPGL, WMF Vector, CorelDRAW Vector, Postscript and IGES.
Traditional manufacturing techniques, such as stamping or inaccurate etching, may produce lids with burrs, irregular edges or sheet fixing-tag remnants - all of which could potentially cause expensive rejects in automated lid-to-package sealing processes - where the whole package could be lost.
Highly-accurate and established photo-chemical machining techniques are used to manufacture the parts. The process also brings other value-added benefits at no extra cost - for example, part numbers, company contact details and other data can be readily etched onto the lid. Typical materials include nickel alloys such as Kovar, Dilver P and Olin 194, other materials are available on request. The company’s in-house electroplating processes encompass all expected finishes - from electroless nickel, to hard-acid gold and pure-soft gold.
Cost-effective solutions for all volume levels can be supplied – with rapid prototyping available on a five-day turnround. Tooling costs are low compared to other methods of manufacture and modifications can be quickly and cost-effectively accommodated. Tecan operates a strict ISO9002 manufacturing regime and can manufacture to UK and overseas military specifications.
The company accepts the following CAD formats: AutoCad DXF and DWG, GraphiCodeCAM PWK and CWK, DPF, Gerber, HPGL, WMF Vector, CorelDRAW Vector, Postscript and IGES.
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