Micro metal part specialist, Tecan Components has developed new manufacturing techniques for the production of semiconductor leadframes, offering significantly higher specifications than traditional techniques to produce economic parts with increased lead density and higher accuracy. Traditional methods of leadframe manufacture include photo-chemical machining and machine punched parts for high-volume production needs, but the techniques have mechanical accuracy limitations. As electronic component packaging moves towards ever-smaller requirements the physical restrictions of these methods have been reached. With proven electroforming technology, Tecan has mapped the way forward by producing leadframes, in any volume and to such high accuracy, that parts can now be made half the original size or with double the lead capacity for the same footprint.

Fine-pitch dimensions and tolerances can now be catered for which were previously not possible or were prohibitively expensive. Application areas are wide and varied, covering low and high lead-count semiconductor, and other multi-lead component needs across the full spectrum of the electronics manufacturing market.

The company is able to supply quantities at all levels of production - from rapid prototypes and small-batch samples, to medium and high-volume needs. The parts can be supplied gold plated and cater for all modern production and assembly techniques - from loose parts, to waffle trays, or tape and reel. Subject to acceptance, a bespoke rapid prototype service guarantees despatch of first samples within five working days. In addition to rapid delivery of the first low-volume parts, the service has other benefits. For example, once a part is adopted, down-the-line production speeds and costs are reduced because the tooling is already in place. Modifications can be cost-effectively incorporated within the company’s powerful CAD system, ensuring any ‘knock-on’ tooling costs are also minimised.

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