You are here: Home > News & Events > Latest News
TEN-TO-ONE MICRO-ENGINEERING WINNER
The process of electroforming has been refined to such a high degree, by Weymouth based specialist Tecan, that the company can now electroform ultra-accurate three-dimensional parts where ‘holes’ and ‘lands’ may be produced up to ten times thinner than their own height – virtually impossible, says the company, using any other technology.
Micro-engineered metal parts produced in this way offer extremely beneficial strength to size ratios – because very fine features can be produced with significantly greater accuracy and mechanical strength than ever before. The advances will be of particular interest to designers and users requiring detailed precision parts with critical tolerances, such as high-strength micro-meshes, screens and optical encoders.
In laboratory conditions, the new system has proven that localised high aspect ratio electroforming is possible – producing any combination of narrow holes, or lands, in deep substrates in close proximity. Refined advances in photo-processing and photo-resist composition lie at the heart of the new capability, says the company.
Using the technology, conceptually new designs, with previously attainable performance characteristics , can be considered. Similarly, existing component designs can be enhanced to provide greater mechanical strength in extremely tight-tolerance regions, or by minimising susceptibility to damage from vibration or shock, for example.
The company points out that current laser techniques are capable of similar ratio levels, but they do not produce smooth wall surfaces and they can only work on a single feature at any one time, making them relatively expensive. Using the new technology, compromises of design due to manufacturing limitations can be greatly reduced, points out Tecan.
The company is now looking for designers and end users to advance the now proven technology in bespoke real-life applications – typically in aeronautical, pharmaceutical, medical, optical and electronics industries.
In laboratory conditions, the new system has proven that localised high aspect ratio electroforming is possible – producing any combination of narrow holes, or lands, in deep substrates in close proximity. Refined advances in photo-processing and photo-resist composition lie at the heart of the new capability, says the company.
Using the technology, conceptually new designs, with previously attainable performance characteristics , can be considered. Similarly, existing component designs can be enhanced to provide greater mechanical strength in extremely tight-tolerance regions, or by minimising susceptibility to damage from vibration or shock, for example.
The company points out that current laser techniques are capable of similar ratio levels, but they do not produce smooth wall surfaces and they can only work on a single feature at any one time, making them relatively expensive. Using the new technology, compromises of design due to manufacturing limitations can be greatly reduced, points out Tecan.
The company is now looking for designers and end users to advance the now proven technology in bespoke real-life applications – typically in aeronautical, pharmaceutical, medical, optical and electronics industries.
Return to Article List or for media enquires please click here
