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New stencil technology optimises PCB manufacturing
Tecan has developed ‘OptiGuard’ a highly versatile stencil for use with the widely adopted VectorGuard® frame. The OptiGuard stencil offers a number of distinct advantages including ease of loading, optimum stencil tension and image stability and a protective stencil border. Furthermore, OptiGuard is available in all stencil manufacturing technologies, from single-thickness laser-cut to multi-level Photo Electro Formed.
Tecan has developed ‘OptiGuard’ a highly versatile stencil for use with the widely adopted VectorGuard® frame. The OptiGuard stencil offers a number of distinct advantages including ease of loading, optimum stencil tension and image stability and a protective stencil border. Furthermore, OptiGuard is available in all stencil manufacturing technologies, from single-thickness laser-cut to multi-level Photo Electro Formed.
Similar to a zip fastener – the OptiGuard stencil features an array of staggered apertures on all four edges that locate with a pin bar, enclosed within the aluminum extrusions.
When mounted on to the VectorGuard® frame and tensioned this ensures excellent all-round rigidity and uniform co-planarity, providing unparalleled image stability and offering enhanced print performance with any printing machine.
Although large CEMs in both the UK and Europe may have existing libraries of Vector or Tetra stencils, many have decided to buy their new stencil requirements in the OptiGuard format. Several have also ordered replacements for some of their existing library in the OptiGuard format, quoting the overall improvement in the printing process and end-of-line quality as the major benefits.
“Key to the success of any solder paste print process is the deposition of exactly the right volume of paste to each and every pad in a single squeegee pass,” said Tony Weldon, Tecan Stencil Manager. “This is increasingly difficult using single thickness laser-cut stencils as modern printed circuit boards typically contain a wide variety of different size and pitch components – each with their own paste volume and co-planarity requirements. OptiGuard stencils can be produced with a variation of thicknesses across the stencil. Thicker areas ensure larger paste deposits for items such as power and I/O connectors and thinner areas enhance the paste release for finer-pitch components.”
All OptiGuard stencils feature the company’s established paste-roll activation (PRA) technology. PRA is a micro-fine pattern created on the squeegee side of the stencil which has been designed to significantly improve paste roll. The PRA wave pattern assists in activating and 'conditioning' the paste to improve its rheology. This paste conditioning also extends the printing life of the paste.
Similar to a zip fastener – the OptiGuard stencil features an array of staggered apertures on all four edges that locate with a pin bar, enclosed within the aluminum extrusions.
When mounted on to the VectorGuard® frame and tensioned this ensures excellent all-round rigidity and uniform co-planarity, providing unparalleled image stability and offering enhanced print performance with any printing machine.
Although large CEMs in both the UK and Europe may have existing libraries of Vector or Tetra stencils, many have decided to buy their new stencil requirements in the OptiGuard format. Several have also ordered replacements for some of their existing library in the OptiGuard format, quoting the overall improvement in the printing process and end-of-line quality as the major benefits.
“Key to the success of any solder paste print process is the deposition of exactly the right volume of paste to each and every pad in a single squeegee pass,” said Tony Weldon, Tecan Stencil Manager. “This is increasingly difficult using single thickness laser-cut stencils as modern printed circuit boards typically contain a wide variety of different size and pitch components – each with their own paste volume and co-planarity requirements. OptiGuard stencils can be produced with a variation of thicknesses across the stencil. Thicker areas ensure larger paste deposits for items such as power and I/O connectors and thinner areas enhance the paste release for finer-pitch components.”
All OptiGuard stencils feature the company’s established paste-roll activation (PRA) technology. PRA is a micro-fine pattern created on the squeegee side of the stencil which has been designed to significantly improve paste roll. The PRA wave pattern assists in activating and 'conditioning' the paste to improve its rheology. This paste conditioning also extends the printing life of the paste.
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