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New encyclopedia offers help with EMC and RFI design needs
Written and produced with both the electronics engineer and today’s electronics product manufacturing needs at its core, a new encyclopedia has been produced by Tecan which comprehensively embraces the design and production of shielding products to satisfy modern-day electromagnetic compatibility (EMC) and radio frequency interference (RFI) needs.
Written and produced with both the electronics engineer and today’s electronics product manufacturing needs at its core, a new encyclopedia has been produced by Tecan which comprehensively embraces the design and production of shielding products to satisfy modern-day electromagnetic compatibility (EMC) and radio frequency interference (RFI) needs.
In great detail, the ‘The World of EMI/RFI Enclosures’ covers all aspects of the design, prototyping and manufacture of off-the-shelf and custom shielding solutions, from cans to complex multi-cavity and totally-enclosed structures.
“The ubiquity of electronics and radio applications in our everyday lives, alongside the changing directives from various regulatory bodies, means there is a greater need than ever to consider the radiated interference between individual equipments and adjacent circuits or PCBs, said Alan Warner, author of the publication and Tecan’s RFI division manager. “The shielding of this interference needs to be considered alongside all of the other design aspects of a product and preferably at an early stage, in order to avoid costly modifications to PCB layouts or equipment re-designs following initial EMC testing.”
Other issues to consider include product testing, handling of the shielding in production, other regulatory directives, such as RoHS compliance, and cost. Embracing these challenges, the new publication covers all the areas necessary for consideration to produce successful results.
In a logical and easy-to-follow format ‘The World of EMI/RFI Enclosures’ takes the engineer through a flowing list of contents allowing each section covered to be considered on its own or in relation to any of the other sections. These include: An introduction to EMC/RFI; RFI/EMI shielding options; PCB level enclosures; Multi-cavity enclosures, Total enclosures; and a useful glossary of terms.
Sections detailed:
An introduction to EMC/RFI - This section details legislation, European Union issues, military and aerospace standards, and the ‘EMC matrix’
RFI/EMI shielding options – This looks at the concept of shielding, levels of shielding and shielding methods.
PCB level enclosures – The largest section in the publication, this covers enclosure design, shielding formats, materials versus frequency, component development, designing for manufacture and assembly to PCBs, access to protected components, multiple cans versus labyrinths, manufacturing methods, PCB design, and surface-mount issues.
Multi-cavity enclosures – This section covers applications, benefits, manufacturing methods and handling.
Total enclosures – Covers applications and the use of photo-chemical machining (PCM) for total enclosures.
In great detail, the ‘The World of EMI/RFI Enclosures’ covers all aspects of the design, prototyping and manufacture of off-the-shelf and custom shielding solutions, from cans to complex multi-cavity and totally-enclosed structures.
“The ubiquity of electronics and radio applications in our everyday lives, alongside the changing directives from various regulatory bodies, means there is a greater need than ever to consider the radiated interference between individual equipments and adjacent circuits or PCBs, said Alan Warner, author of the publication and Tecan’s RFI division manager. “The shielding of this interference needs to be considered alongside all of the other design aspects of a product and preferably at an early stage, in order to avoid costly modifications to PCB layouts or equipment re-designs following initial EMC testing.”
Other issues to consider include product testing, handling of the shielding in production, other regulatory directives, such as RoHS compliance, and cost. Embracing these challenges, the new publication covers all the areas necessary for consideration to produce successful results.
In a logical and easy-to-follow format ‘The World of EMI/RFI Enclosures’ takes the engineer through a flowing list of contents allowing each section covered to be considered on its own or in relation to any of the other sections. These include: An introduction to EMC/RFI; RFI/EMI shielding options; PCB level enclosures; Multi-cavity enclosures, Total enclosures; and a useful glossary of terms.
Sections detailed:
An introduction to EMC/RFI - This section details legislation, European Union issues, military and aerospace standards, and the ‘EMC matrix’
RFI/EMI shielding options – This looks at the concept of shielding, levels of shielding and shielding methods.
PCB level enclosures – The largest section in the publication, this covers enclosure design, shielding formats, materials versus frequency, component development, designing for manufacture and assembly to PCBs, access to protected components, multiple cans versus labyrinths, manufacturing methods, PCB design, and surface-mount issues.
Multi-cavity enclosures – This section covers applications, benefits, manufacturing methods and handling.
Total enclosures – Covers applications and the use of photo-chemical machining (PCM) for total enclosures.
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