On October 22nd 2003, printed circuit process specialist MacDermid, and stencil specialist Tecan, will jointly host ‘Final Finish’, a one-day printed circuit board (PCB) conference aimed at designers, PCB fabricators, assemblers, OEMs and CEMs. The event will be held at the Hayley Conference Centre, Ettington Chase, Stratford, UK.

Following a welcome address, attendees will be presented with a series of detailed conference sessions covering a wide range of current and future technologies relevant to the optimisation of PCB manufacturing processes.

The morning will be dedicated to the following areas of interest: Planar - Electroless nickel / gold; M Coat Plus - OCP; Macstan - Immersion Tin; and Sterling - Immersion Silver. Following a buffet luncheon, the afternoon session will look at: The assembly of PCB surface finishes; and stencil design influences with regard to lead-free print processing.

The stencil session will be presented by Tecan and will look closely at the key to optimising the surface-mount line through control of the print process itself. The company’s paper will look at the stencil design issues involved in achieving control of the print process. These include: Available stencil technology choices; Aperture sizes and reductions required to achieve the desired solder fillets; Selection of individual stencil thicknesses appropriate to the mix of components on today’s assemblies. The conference will conclude with an open forum. To secure your place at ‘Final Finish’ call Leon McMahon at Tecan on 01305 765432, places are limited.

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