Weymouth based Tecan Stencils Ltd (TSL) has designed an effective frame for handling solder paste stencils during the cleaning process, saving time and money - typically for medium and high volume PCB manufacturers.

Many problems are currently encountered while transferring stencils to and from the cleaning area and in the cleaning machines and tanks themselves. Tecan would not recommend the immersion or cleaning of stencils on re-mountable frames. Prolonged exposure to today’s cleaning solutions can damage the frames and also the loss of the frame, whilst cleaning, significantly reduces operational efficiency.

Tecan’s innovative solution ensures the re-mountable printing frame remains within the production environment, maximising its continued use. The stencil is easily and quickly transferred to the cleaning frame using a simple adjustable quick release mechanism. In addition to double-ended axial tensioning the frame has mid section support to stabilise the stencil, avoiding subsequent damage, throughout the cleaning cycle.

Since there is minimal physical contact between the stencil and the frame itself, the stencil can be efficiently cleaned whilst under safe tension - whatever the cleaning system used. When removed from the tank, the frame’s design ensures the maximum drainage or run off of the cleaning solution from the stencil itself limiting staining.

Robust stainless steel construction offers compatibility with any known cleaning solution available today. Frames are available to suit all re-mountable stencil types and can incorporate individual requirements such as non-standard cleaning tank dimensions.

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