You are here: Home > News & Events > Latest News
PIN-IN-HOLE RE-FLOW STENCILS OPTIMISE SM BOARD YIELDS
Tecan Stencils Limited (TSL), is to host a series of autumn seminars highlighting the advantages of pin-in-hole reflow (PIHR) - a technology aimed at PCB producers wishing to assemble both SMT and through-hole components on the same board.
Using a combination of multi-level stencils and reactive squeegees in a single operation, PIHR can eliminate the need for subsequent hand or wave soldering. The technique ensures exactly the right paste volumes are deposited, for SM and through-hole components - producing shorter product cycle times, reduced manufacturing costs and the elimination of second operation flux deposits.
Multi-level stencils offer distinct thicknesses on the same stencil, tailored to produce the extra volumes required for PIHR needs, such as connectors, while also ensuring the appropriate thickness for the finest pitch SM components. Careful calculation of the appropriate individual paste volumes required is crucial, says the company, to ensure the resultant solder fillets meet acceptable quality criteria.
Other novel factors enabling the success of the technique include printing ‘off pad’, accurate insertion of through-hole components with limited lead lengths, appropriate squeegee pressure and speed, and suitable thermo-mechanical component body characteristics.
It is not always necessary to use multi-level stencils, the company can provide optimum stencil solutions, cost-effectively, whatever the individual need. The highly-accurate stencils can be produced by using precision etching in combination with laser cutting, or by electroforming - all in-house. Using the new methods, and provided the recommended guidelines are followed, the technology is compatible with existing production techniques, personnel and processes.
Seminars
During September, October and November, the company is hosting a series of seminars where PIHR techniques and essential guidelines will be presented in detail to industry professionals. For details and dates - please call TSL on 01305 765400.
Multi-level stencils offer distinct thicknesses on the same stencil, tailored to produce the extra volumes required for PIHR needs, such as connectors, while also ensuring the appropriate thickness for the finest pitch SM components. Careful calculation of the appropriate individual paste volumes required is crucial, says the company, to ensure the resultant solder fillets meet acceptable quality criteria.
Other novel factors enabling the success of the technique include printing ‘off pad’, accurate insertion of through-hole components with limited lead lengths, appropriate squeegee pressure and speed, and suitable thermo-mechanical component body characteristics.
It is not always necessary to use multi-level stencils, the company can provide optimum stencil solutions, cost-effectively, whatever the individual need. The highly-accurate stencils can be produced by using precision etching in combination with laser cutting, or by electroforming - all in-house. Using the new methods, and provided the recommended guidelines are followed, the technology is compatible with existing production techniques, personnel and processes.
Seminars
During September, October and November, the company is hosting a series of seminars where PIHR techniques and essential guidelines will be presented in detail to industry professionals. For details and dates - please call TSL on 01305 765400.
Return to Article List or for media enquires please click here
